![](http://www.ssinee.com/wp-content/uploads/2023/04/6739-英.jpg)
CPU: MediaTek MT6739
Architecture: ARM Cortex-A53 Quad-core 1.5GHz
OS : Andriod 9.0
Memory : 1GB+8GB/2GB+16GB/3GB+32GB
Network support : 2G/3G/4G full network access
Wireless connectivity : WiFi/Bluetooth/GPS/Beidou
Product introduction
XY6739CW is a 4G smart module based on MTK’s MTK6739 platform, industrial grade and high performance, running Android OS, supporting LTE-FDD/LTE-TDD/WCDMA/TD-SCDMA/EVDO/CDMA/GSM and other standards; supporting WiFi 802.11b/g/n, BT4.0LE Near-range wireless communication, support GPS/GLONASS/BeiDou satellite positioning; support a variety of voice and audio codecs, internal integration of IMG 8XE high-performance graphics engine, can smoothly play 1080P video; have multiple audio, video input and output interfaces and rich GPIO interface.
The supported frequency bands are listed below:
Type | Network band |
LTE-FDD (with Rx-diversity) | B1/B3/B5/B8/B20 |
LTE-TDD (with Rx-diversity) | B38/B39/B40/B41 |
WCDMA | B1/B2/B5/B8 |
TD-SCDMA | B34/B39 |
EVDO/CDMA | BC0 |
GSM | 850/900/1800MHz |
WiFi 802.11a/b/g/n | 2400-2483.5MHz/5725-5850MHz |
BT4.0 LE | 2400-2483.5MHz |
GNSS | GPS+Glonass/Beidou |
Main performance parameters
The following describes the detailed performance parameters of the XY6739
Application processor:
Quad-core ARM Cortex-A53 processor; main frequency up to 1.5 GHz; 256KB Level 2 cache
Modem processor:
MIPS32, ARM up to 600 MHz, 256KB L2
Power supply:
VBAT supply voltage range: 3.5V~4.3V
Typical supply voltage: 4.0V
Transmit Power
Class 4 (33dBm±2dB) for GSM850/GSM900
Class 1 (30dBm±2dB) for DCS1800
Class E2 (27dBm±3dB) for EGSM900/GSM850 8PSK
Class E2 (26dBm±3dB) for DCS1800 8PSK
Class 3 (24dBm+1/-3dB) for WCDMA bands
Class 3 (24dBm+1/-3dB) for CDMA BC0
Class 3 (24dBm+1/-3dB) for TD-SCDMA B34/B39
Class 3 (23dBm ±2.7dB) for LTE FDD bands
Class 3 (23dBm ±2.7dB) for LTE TDD bands
LTE Features:
Supports 3GPP R9 CAT4 FDD and TDD
Supports 1.4 – 20 MHz RF bandwidth
Supports downlink 2 x 2 MIMO
FDD: Max 150Mbps (DL), 50Mbps (UL)
TDD: Max 100Mbps (DL), 40Mbps (UL)
WCDMA features:
Supports 3GPP R9 DC-HSPA+
Support 16-QAM, 64-QAM and QPSK modulation
3GPP R6 HSUPA: Max 11Mbps (UL)
3GPP R8 DC-HSPA+: Max 42Mbps (DL)
TD-SCDMA features:
Support 3GPP R8 1.28 TDD
TD-HSDPA:MAX 2.8Mbps (DL)
TD-HSUPA:MAX 2.2Mbps (UL)
CDMA features: Max 3.1Mbps (DL), 1.8 Mbps (UL)
GSM/GPRS/EDGE features:
GPRS: Support GPRS multi-slot class 12
Coding formats: CS-1, CS-2, CS-3 and CS-4
Maximum 4 Rx time slots per frame
GSM/GPRS/EDGE features:
EDGE:
Supports EDGE multi-slot class 12
GMSK and 8PSK support
Coding formats: CS1-4 and MCS 1-9
WLAN features: 2.4GHz/5GHz dual-band, support 802.11a/b/g/n, up to 150Mbps; support AP mode
Bluetooth features: BT4.0 LE
Satellite positioning: GPS+Glonass/Beidou
Short Message (SMS):
Text and PDU modes
Point-to-point MO and MT
SMS Broadcast
SMS Storage: Default SIM
AT commands not supported
LCM Interface:
4 groups of MIPI_DSI, each supporting up to 1.0Gbps rate;
Supports up to 1440*720 60fps (4 groups of MIPI_DSI);
24bit color depth
Camera interface:
4 groups of MIPI_CSI, each group supports up to 1.5Gbps rate, can support 2 cameras;
Rear camera with 4 groups of MIPI_CSI, supporting up to 13MP pixels
Front camera uses 4 groups of MIPI_CSI, supporting up to 13MP pixels
Front and rear cameras can support dual recording, picture-in-picture function
Audio Interface
Audio input:
3 groups of analog microphone inputs
1 as headset MIC input, the other two are normal call noise reduction MIC
Audio output
Class AB stereo headphone output
Class AB differential earpiece output
Class AB/D differential speaker amplifier output 0.8W
USB interface:
Support USB2.0 high-speed mode, data transfer rate up to 480Mbps
For software debugging and software upgrade, etc.
Support USB OTG (requires additional 5V power supply chip)
USIM card interface:
2 groups of USIM card interface
Support USIM/SIM card: 1.8V and 3V
Support dual card dual standby
SDIO interface: support SD3.0; 4bit SDIO; SD/MMC card; support hot-swappable
I2C interface: 4 groups of I2C, the highest rate up to 400K, when using I2C DMA the highest speed can reach 3.4Mbps, for TP, Camera, Sensor and other peripherals
ADC interface: 1 way, for general purpose ADC
Antenna interface MAIN antenna, DRX antenna, GNSS antenna, WIFI/BT antenna interface
Physical characteristics:
Size: 40.5±0.15×50.5±0.15×2.8±0.2 mm
Interface: LCC
Warpage: <0.3mm<>
<0.3mm<>
Weight: 10.9g
Temperature range:
Normal operating temperature: -20°C ~ +70°C
Extreme operating temperature: -25°C and +80°C 1)
Storage temperature: -40°C ~ +85°C
Software upgrade: via USB
RoHS: RoHS compliant
XY6739 functional block diagram illustrating its main functions:
Power Management
RF section
Baseband section
LPDDR3+EMMC memory
Peripheral Interface
–USB interface
–USIM card interface
–UART interface
–SDIO Interface
–I2C interface
–ADC interface
–LCD (MIPI) interface
–TP interface
–CAM(MIPI) interface
–AUDIO interface
![](http://www.ssinee.com/wp-content/uploads/2023/04/040819.png)
Development Boards
To help test and use the XY6739 module, MobileTech can provide a set of development boards.
Application Interfaces
Overview
The XY6739 has 166 SMT pads with 1.0mm pitch. The following sections detail the functions of the module’s various interface groups:
Power Supply
VRTC Interface
LCM Interface
TP interface
Camera interface
Audio Interface
USB Interface
USIM Interface
UART Interface
SDIO Interface
I2C Interface
ADC interface
XY6739 pin assignment diagram:
![](http://www.ssinee.com/wp-content/uploads/2023/04/040820.png)