XY6873A 5G Android smart core board (MT6873 Dimensity 800 platform)

CPU: MediaTek MT6873 Dimensity 720
Architecture: 4X ARM Cortex-A76 up to 2.0GHz + 4X ARM Cortex-A55 up to 2.0GHz
OS : Andriod 11.0
Memory : 4GB+64GB/6GB+128GB
Display : FHD+ support (1080X2520)
Camera : 64 million
Network support : 2G/3G/4G/5G full network access
Wireless connectivity: WiFi/Bluetooth/GPS/Beidou
NPU: 1T computing power

Product introduction

XY6873 is a 5G AI smart module based on MTK’s MT6873 (MediaTek Dimensity 800) platform, industrial-grade high-performance, running Android 11.0 operating system, supporting NR-SA/NR-NSA/LTE-FDD(CAT-18)/LTE-TDD(CAT-18)/WCDMA/TD-SCDMA/EVDO/CDMA/GSM, etc. SCDMA/EVDO/CDMA/GSM etc.; support WiFi 5 802.11 a/b/g/n/ac, BT v2.1+EDR, 3.0+HS,v4.1+HS,V5.1, support Beidou(BeiDou),Galileo,Glonass,GPS,QZSS multiple system satellite positioning; have multiple Audio and video input and output interfaces and rich GPIO interfaces. The supported frequency bands are listed below:

Network band

TypeNetwork band
DL CCAB1/B3/B7/B38/B39/B40/B41
Inter CAB1+B3 B3+B5 B1+B5 B39+B41
UL CCAB3/B38/B39/B40/B41
WiFi 802.11a/b/g/n/ac2400~2483.5MHz/5725~5850MHz/5925MHz
BT V2.1+EDR,3.0+HS,V4.2+HS,BT5.12400~2483.5MHz

*Note: The frequency band is subject to specific shipment.

XY6873 is a chip module with 184LCC+237LGA pins. With a size of only 50.0mm × 50.0mm × 2.65mm, it can be embedded in various M2M product applications via solder pads and is ideal for developing mobile devices such as car computers, multimedia terminals, smart homes, IoT terminals, etc.


1.1. DL CCA: Downlink Intra-band Contiguous Carrier Aggregation

2. DL NCCA: Downlink Intra-band No-Contiguous Carrier Aggregation Downlink Intra-band Non-Contiguous Carrier Aggregation

3. Inter CA: Inter band Carrier Aggregation Inter-band Carrier Aggregation

4.UL CCA: Uplink Intra-band Contiguous Carrier Aggregation Uplink Intra-band Contiguous Carrier Aggregation

Main performance parameters

Application Processors4xCortex-A76up to 2.0GHz + 4xCortex-A55 up to 2.0GHz
Camera interface4xMIPI CSI(4 Data lanes)64MP @ 30fps
video decode4K 30fps H.264/H.265/VP9
video encode4K 30fps H.264/H.265
LCM interfaceMIPI DSI (4 Data lanes) highest resolution support FHD+ (1080×2520)
AI AcceleratorUp to 2.4TOPs (2.4 trillion operations per second)

Modem Processor
2 MDSP RVSS Processor ARM Maximum Frequency 416MHz
Electricity supplyVBAT supply voltage range: 3.5V~4.35V Typical supply voltage: 4.2V
Transmitting powerClass 4 (33dBm±2Db) for GSM850/GSM900 Class 1 (30dBm±2Db) for DCS1800/PCS1900Class E2 (27dBm±3Db) for EGSM900/GSM850 8PSK Class E2 (26dBm±3Db) for DCS1800/PCS1900 8PSKClass 3 (24dBm+1/-3Db) for WCDMA bands Class 3 (24dBm+1/-3Db) for CDMA BC0Class 3 (24dBm+1/-3Db) for TD-SCDMA B34/B39 Class 3 (23dBm ±2.7Db) for LTE FDD bands Class 3 (23dBm ±2.7Db) for LTE TDD bands Class 3 (23dBm ±2.7Db) for NR SA bandsClass 3 (23dBm ±2.7Db) for NR NSA bands
NR CharacteristicsSupport 3GPP R15 3.5Gbps DL/775Mbps UL Support 5 – 100 MHz RF bandwidth Support downlink 4 x 4 MIMO,uplink 2 x 2 MIMO SA: Max 2.3Gbps (DL), 625Mbps (UL)NSA: Max 3.5Gbps (DL), 775Mbps (UL)
LTE FeaturesSupport 3GPP R11 LTE CAT-18 DL/CAT-13 UL support 1.4 – 20 MHz RF bandwidth support downlink 4 x 4 MIMOFDD: Max 1.2Gbps (DL), 150Mbps (UL) TDD: Max 1.2Gbps (DL), 150Mbps (UL)
WCDMA FeaturesSupport 3GPP R9 DC-HSPA+ supports 16-QAM, 64-QAM and QPSK modulation 3GPP R6 HSUPA: 11.5Mbps max (UL) 3GPP R8 DC-HSPA+: 42.2Mbps max (DL)
TD-SCDMA FeaturesSupport 3GPP R8 1.28 TDD TD-HSDPA:MAX 2.8Mbps(DL)
GSM/GPRS/EDGE FeaturesEDGE: Support EDGE multi-slot class 12 Support GMSK and 8PSK encoding formats: CS1-4 and MCS 1-9
WLAN Features2.4GHz/5GHz dual-band, supports 802.11a/b/g/n/ac, up to 1700Mbps, supports AP mode
Bluetooth FeaturesBT v2.1+EDR,3.0+HS,v4.1+HS,V5.1 (Low Energy)
Satellite positioningBeidou,Galileo,Glonass,GPS,QZSS
EMMC/UFSSupports up to UFS2.1, 256G Byte.
DDRSupports up to 12G Byte @ 2 channels 16bit x LPDDR4X 4266MHz
SMSText with PDU mode point-to-point MO and MT SMS Broadcast SMS storage: default SIM
AT commandNot supported
Audio InterfaceAudio input: 3 groups of analog microphone input 1 as a headset MIC input, the other two are normal call noise reduction MIC Audio output: AB class stereo headphone output AB class differential earpiece output AB class differential output to external audio amplifier
USB InterfaceSupport USB3.0 Host/Device mode, data transfer rate up to 5.0Gbps for software debugging and software upgrade, etc. Support USB2.0 OTG
USIM card interface2 groups of USIM card interface support USIM/SIM card: 1.8V and 3V support dual card dual standby
SDIO InterfaceSupport SD/SDHC/MS/MSPRO/MMC/SDIO2.0 or 3.0 4bit SDIO, 8bit SDIO support hot-swap
I2C Interface10 I2C groups, up to 400K, up to 3.4Mbps when using DMA with I2C for peripherals such as TP, Camera, Sensor, etc.
SPI Interface8 SPI interfaces, up to 27Mbit/s, DMA mode supported.
DPI Interface1 group 12 bit DPI interface, DPI clock up to 148.5MHz.
ADC InterfaceQuad for general purpose 12 bit ADC,Input range=0.05~1.45V
Antenna Interface7 RF antenna, WIFI/GNSS/BT antenna, WIFI2 antenna, FM RX antenna interfaces
Physical CharacteristicsSize: 50±0.15×50±0.15×2.65±0.2 mm
Interface: 184LCC+237LGA Warpage: <0.3mm Weight: 10.9g
Temperature rangeNormal operating temperature: -20°C to +70°C Extreme operating temperature: -25°C and +80°C 1) Storage temperature: -40°C to +85°C
Software Upgradevia USB
RoHSRoHS compliant

1. indicates that when the module operates in this temperature range, the RF performance may deviate from the specification, for example, the frequency error or phase error will increase, but it will not drop out.

2. “*” indicates that this feature is currently under development.

Functional block diagram

The following diagram shows the XY6873 functional block diagram, which describes its main functions:

Power Management

RF section

Baseband section


Peripheral Interface

–USB Interface

–USIM card Interface

–SDIO Interface

–I2C Interface

–SPI Interface

–ADC Interface

–LCD(MIPI) Interface

–TP Interface

–CAM(MIPI) Interface

–AUDIO Interface

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