XY6737 core board (MTK6737 platform)

CPU: MediaTek MT6737T
Architecture: ARM Cortex-A53 Quad-core 1.5GHz
OS : Andriod 7.0
Memory : 1GB+8GB/2GB+16GB/3GB+32GB
Network support : 2G/3G/4G full network access
Wireless connectivity : WiFi/Bluetooth/GPS/Beidou

Product introduction

MT6737 core board is a high performance 4G smart module based on MediaTek MT6737T platform that can run Android OS, supporting LTE-FDD/LTE-TDD/WCDMA/TD-SCDMA/EVDO/CDMA/GSM and other standards; supporting WiFi 802.11a/b/g/n, BT4.0LE proximity Wireless communication, support GPS/GLONASS/BeiDou satellite positioning; support a variety of voice and audio codecs, internal integration of Mali-T720 MP2 high-performance graphics engine, can smoothly play 1080P video; with multiple audio, video input and output interfaces and rich GPIO interface.

Network band

TypeNetwork band
LTE-FDD (with Rx-diversity)B1/B3/B5/B8
LTE-TDD (with Rx-diversity)B38/B39/B40/B41
WCDMAB1/B5/B8
TD-SCDMAB34/B39
EVDO/CDMABC0
GSM850/900/1800MHz
WiFi 802.11b/g/n2400-2483.5MHz/5725-5850MHz
BT4.0 LE2400-2483.5MHz
GNSSGPS/GLONASS/北斗

Main performance parameters

PerformanceDescription
Application Processors 4-core ARM Cortex-A53 processor up to 1.5GHz 512kB Level 2 cache
Modem ProcessorARM@Cortex-R4 + DSPARM maximum frequency 600MHz, DSP frequency 250MHz 512KB L2
Electricity supplyVBAT supply voltage range: 3.5V~4.3V Typical supply voltage: 4V
SMSText with PDU mode point-to-point MO and MTSMS broadcast SMS storage: default SIM
LCM interface4 groups of MIPI_DSI, each group supports up to 1.0Gbps rate; up to 1920*1080 60fps (4 groups of MIPI_DSI); 24bit color depth
Camera interface4 groups of MIPI_CSI, each group supports up to 1.5Gbps rate, can support 2 cameras; rear camera using 4 groups of MIPI_CSI, supports up to 13MP pixels front camera using 4 groups of MIPI_CSI, supports up to 13MP pixels front and rear cameras can support dual recording, picture-in-picture function
Audio InterfaceAudio input: 3 groups of analog microphone input 1 way as a headset MIC input, the other two are normal call noise reduction MIC audio output: AB class stereo headphone output AB class differential earpiece output AB / D class differential speaker amplifier output 0.8W
USB InterfaceSupport USB2.0 high-speed mode, data transfer rate of up to 480Mbps for software debugging and software upgrades, etc. Support USB OTG (requires additional 5V power supply chip)
USIM card interface2 groups of USIM/SIM card interface support: 1.8V and 3V support dual SIM card dual standby
SDIO interfaceSupport SD2.0; 4bit SDIO; SD/MMC card support hot-swap
I2C interface4 groups of I2C, maximum rate up to 400K, when using I2C DMA the maximum speed can reach 3.4Mbps, for TP, Camera, Sensor and other peripherals
ADC interface1 way for general purpose ADC
Antenna InterfaceMAIN antenna, DRX antenna, GNSS antenna, WIFI/BT antenna interface
Physical CharacteristicsSize: 40.5±0.15×50.5±0.15×2.8±0.2 mm Interface: LCC Warpage: <0.3mm Weight: 10.9g
Temperature rangeNormal working temperature: -20°C ~ +70°C Extreme working temperature: -25°C and +80°C 1) Storage temperature: -40°C ~ +85°C
Software Upgradevia USB
RoHSRoHS compliant