CPU: MediaTek MT6737T Architecture: ARM Cortex-A53 Quad-core 1.5GHz OS : Andriod 7.0 Memory : 1GB+8GB/2GB+16GB/3GB+32GB Network support : 2G/3G/4G full network access Wireless connectivity : WiFi/Bluetooth/GPS/Beidou
Product introduction
MT6737 core board is a high performance 4G smart module based on MediaTek MT6737T platform that can run Android OS, supporting LTE-FDD/LTE-TDD/WCDMA/TD-SCDMA/EVDO/CDMA/GSM and other standards; supporting WiFi 802.11a/b/g/n, BT4.0LE proximity Wireless communication, support GPS/GLONASS/BeiDou satellite positioning; support a variety of voice and audio codecs, internal integration of Mali-T720 MP2 high-performance graphics engine, can smoothly play 1080P video; with multiple audio, video input and output interfaces and rich GPIO interface.
Network band
Type
Network band
LTE-FDD (with Rx-diversity)
B1/B3/B5/B8
LTE-TDD (with Rx-diversity)
B38/B39/B40/B41
WCDMA
B1/B5/B8
TD-SCDMA
B34/B39
EVDO/CDMA
BC0
GSM
850/900/1800MHz
WiFi 802.11b/g/n
2400-2483.5MHz/5725-5850MHz
BT4.0 LE
2400-2483.5MHz
GNSS
GPS/GLONASS/北斗
Main performance parameters
Performance
Description
Application Processors
4-core ARM Cortex-A53 processor up to 1.5GHz 512kB Level 2 cache
Modem Processor
ARM@Cortex-R4 + DSPARM maximum frequency 600MHz, DSP frequency 250MHz 512KB L2
Electricity supply
VBAT supply voltage range: 3.5V~4.3V Typical supply voltage: 4V
SMS
Text with PDU mode point-to-point MO and MTSMS broadcast SMS storage: default SIM
LCM interface
4 groups of MIPI_DSI, each group supports up to 1.0Gbps rate; up to 1920*1080 60fps (4 groups of MIPI_DSI); 24bit color depth
Camera interface
4 groups of MIPI_CSI, each group supports up to 1.5Gbps rate, can support 2 cameras; rear camera using 4 groups of MIPI_CSI, supports up to 13MP pixels front camera using 4 groups of MIPI_CSI, supports up to 13MP pixels front and rear cameras can support dual recording, picture-in-picture function
Audio Interface
Audio input: 3 groups of analog microphone input 1 way as a headset MIC input, the other two are normal call noise reduction MIC audio output: AB class stereo headphone output AB class differential earpiece output AB / D class differential speaker amplifier output 0.8W
USB Interface
Support USB2.0 high-speed mode, data transfer rate of up to 480Mbps for software debugging and software upgrades, etc. Support USB OTG (requires additional 5V power supply chip)
USIM card interface
2 groups of USIM/SIM card interface support: 1.8V and 3V support dual SIM card dual standby
SDIO interface
Support SD2.0; 4bit SDIO; SD/MMC card support hot-swap
I2C interface
4 groups of I2C, maximum rate up to 400K, when using I2C DMA the maximum speed can reach 3.4Mbps, for TP, Camera, Sensor and other peripherals
ADC interface
1 way for general purpose ADC
Antenna Interface
MAIN antenna, DRX antenna, GNSS antenna, WIFI/BT antenna interface
Physical Characteristics
Size: 40.5±0.15×50.5±0.15×2.8±0.2 mm Interface: LCC Warpage: <0.3mm Weight: 10.9g
Temperature range
Normal working temperature: -20°C ~ +70°C Extreme working temperature: -25°C and +80°C 1) Storage temperature: -40°C ~ +85°C
