XY6761 core board (MTK6761 platform)

CPU: MediaTek MT6761
Architecture: ARM Cortex-A53 Quad-core 2.0GHz
OS : Andriod 9.0
Memory : 4GB+64GB/6GB+128GB
Network support : 2G/3G/4G full network access
Wireless connectivity : WiFi/Bluetooth/GPS/Beidou

Product introduction

XY6761 is a MTK platform-based, industrial-grade high-performance 4G smart module that can run Android 9.0 operating system, the three modules are hardware compatible with each other, supporting LTE-FDD (CAT-7)/LTE-TDD (CAT-7)/WCDMA/TD-SCDMA/EVDO/CDMA/GSM and other systems; support WiFi 802.11 a/b/g/n/ac, BT v2.1+EDR, 3.0+HS,v4.1+HS, GPS/GLONASS/BeiDou satellite positioning; multiple audio and video input/output interfaces and rich GPIO interfaces.

Network band

TypeNetwork band
LTE-FDD B1/B2/B3/B5/B7/B8/B20(B17)/B28
LTE-TDD B34/B38/B39/B40/B41
DL CCAB1/B3/B7/B38/B39/B40/B41
Inter CAB1+B3 B3+B5 B1+B5 B39+B41
UL CCAB3/B38/B39/B40/B41
WiFi 802.11a/b/g/n/ac2400~2483.5MHz/5725~5850MHz/5925MHz

Main performance parameters

Application Processors 12nm quad-core ARM@Cortex-A53 processor single-core up to 2.0GHz
Modem ProcessorMIPS32 processor ARM maximum frequency 864MHz256KB L2
Electricity supplyVBAT supply voltage range: 3.5V~4.35V Typical supply voltage: 4.2V
SMSText with PDU mode point-to-point MO and MTSMS broadcast SMS storage: default SIM
AT commandNot supported
LCM interface4 groups of MIPI_DSI, each group supports up to 1.2Gbps rate; up to 1600*720 HD+ (4 groups of MIPI_DSI); 24bit color depth
Camera interface4 groups of MIPI_CSI, each group supports up to 2.5Gbps rate, can support 2 cameras; rear camera using 4 groups of MIPI_CSI, support up to 24M@30fps front camera using 4 groups of MIPI_CSI, support up to 24M@30fps front and rear cameras can support dual recording, picture-in-picture function
Audio InterfaceAudio input: 3 groups of analog microphone input 1 way as a headset MIC input, the other two are normal call noise reduction MIC audio output: AB class stereo headphone output AB class differential earpiece output AB class differential output to external audio amplifier
USB interfaceSupport USB2.0 high-speed mode, data transfer rate up to 480Mbps for software debugging and software upgrades, etc. Support USB OTG
USIM card interface2 groups of USIM/SIM card interface support: 1.8V and 3V support dual SIM card dual standby
SDIO interfaceSupport SD/SDHC/MS/MSPRO/MMC/SDIO2.0 or 3.0 4bit SDIO support hot-swap
I2C interface4 groups of I2C, maximum rate up to 400K, when using I2C DMA the maximum speed can reach 3.4Mbps, for TP, Camera, Sensor and other peripherals
ADC interfaceTwo channels for general purpose ADC,Input range=0.05~1.45V
Antenna InterfaceMAIN antenna, DRX antenna, GNSS antenna, WIFI/BT antenna interface
Physical CharacteristicsSize: 40.5±0.15×50.5±0.15×2.8±0.2 mm Interface: LCC Warpage: <0.3mm Weight: 10.9g
Temperature rangeNormal working temperature: -20°C ~ +70°C Extreme working temperature: -25°C and +80°C 1) Storage temperature: -40°C ~ +85°C
Software Upgradevia USB
RoHSRoHS compliant